HCF4069UBEY STMicroelectronics IC INVERTER 6CH 6-INP 14DIP

label:
2024/11/27 46
HCF4069UBEY STMicroelectronics  IC INVERTER 6CH 6-INP 14DIP


• MEDIUM-SPEED OPERATIONtPD = 30ns (Typ.) at 10V
• STANDARDIZED SYMMETRICAL OUTPUT CHARACTERISTICS
• QUIESCENT CURRENT SPECIFIED UP TO 20V
• 5V, 10V AND 15V PARAMETRIC RATINGS
• INPUT LEAKAGE CURRENT II = 100nA (MAX) AT VDD = 18V TA = 25°C
• 100% TESTED FOR QUIESCENT CURRENT
• MEETS ALL REQUIREMENTS OF JEDEC JESD13B " STANDARD SPECIFICATIONS FOR DESCRIPTION OF B SERIES CMOS DEVICES"


CATALOG
HCF4069UBEY COUNTRY OF ORIGIN
HCF4069UBEY PARAMETRIC INFO
HCF4069UBEY PACKAGE INFO
HCF4069UBEY MANUFACTURING INFO
HCF4069UBEY PACKAGING INFO
HCF4069UBEY ECAD MODELS


COUNTRY OF ORIGIN
Indonesia
China


PARAMETRIC INFO
Logic Family 4000B
Process Technology CMOS
Logic Function Inverter
Number of Elements per Chip 6
Minimum Operating Supply Voltage (V) 3
Maximum Operating Supply Voltage (V) 20
Typical Operating Supply Voltage (V) 3.3|5|9|12|15|18
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Maximum Propagation Delay Time @ Maximum CL (ns) 110@5V|60@10V|50@15V
Absolute Propagation Delay Time (ns) 110
Propagation Delay Test Condition (pF) 50
Maximum High Level Output Current (mA) -2.4(Min)
Maximum Low Level Output Current (mA) 2.4(Min)
Maximum Quiescent Current (uA) 5
Typical Quiescent Current (uA) 0.02


PACKAGE INFO
Supplier Package PDIP
Basic Package Type Through Hole
Pin Count 14
Lead Shape Through Hole
PCB 14
Tab N/R
Pin Pitch (mm) 2.54
Package Length (mm) 20(Max)
Package Width (mm) 7.1(Max)
Package Height (mm) 5.1(Max) - 0.51(Min)
Package Diameter (mm) N/R
Seated Plane Height (mm) 5.1(Max)
Mounting Through Hole
Package Material Plastic
Package Description Plastic Dual In Line Package
Package Family Name DIP
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Number of Reflow Cycle N/R
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
Number of Wave Cycles 2


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 25
Packaging Document Link to Datasheet


ECAD MODELS
Produkto RFQ