STM32L476RGT6 STMicroelectronics IC MCU 32BIT 1MB FLASH 64LQFP

label:
2023/11/20 234


• Ultra-low-power with FlexPowerControl
   – 1.71 V to 3.6 V power supply
   – -40 °C to 85/105/125 °C temperature range
   – 300 nA in VBAT mode: supply for RTC and 32x32-bit backup registers
   – 30 nA Shutdown mode (5 wakeup pins)
   – 120 nA Standby mode (5 wakeup pins)
   – 420 nA Standby mode with RTC
   – 1.1 µA Stop 2 mode, 1.4 µA with RTC
   – 100 µA/MHz run mode (LDO Mode)
   – 39 μA/MHz run mode (@3.3 V SMPS Mode)
   – Batch acquisition mode (BAM)
   – 4 µs wakeup from Stop mode
   – Brown out reset (BOR)
   – Interconnect matrix
• Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait-state execution from Flash memory, frequency up to 80 MHz, MPU, 100DMIPS and DSP instructions
• Performance benchmark
   – 1.25 DMIPS/MHz (Drystone 2.1)
   – 273.55 CoreMark® (3.42 CoreMark/MHz @ 80 MHz)
• Energy benchmark
   – 294 ULPMark™ CP score
   – 106 ULPMark™ PP score
• Clock Sources
   – 4 to 48 MHz crystal oscillator
   – 32 kHz crystal oscillator for RTC (LSE)
   – Internal 16 MHz factory-trimmed RC (±1%)
   – Internal low-power 32 kHz RC (±5%)
   – Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25 % accuracy)
   – 3 PLLs for system clock, USB, audio, ADC
• Up to 114 fast I/Os, most 5 V-tolerant, up to 14 I/Os with independent supply down to 1.08 V
• RTC with HW calendar, alarms and calibration
• LCD 8× 40 or 4× 44 with step-up converter
• Up to 24 capacitive sensing channels: support touchkey, linear and rotary touch sensors
• 16x timers: 2x 16-bit advanced motor-control, 2x 32-bit and 5x 16-bit general purpose, 2x 16- bit basic, 2x low-power 16-bit timers (available in Stop mode), 2x watchdogs, SysTick timer
• Memories
   – Up to 1 MB Flash, 2 banks read-whilewrite, proprietary code readout protection
   – Up to 128 KB of SRAM including 32 KB with hardware parity check
   – External memory interface for static memories supporting SRAM, PSRAM, NOR and NAND memories
   – Quad SPI memory interface
• 4x digital filters for sigma delta modulato
• Rich analog peripherals (independent supply)
   – 3x 12-bit ADC 5 Msps, up to 16-bit with hardware oversampling, 200 µA/Msps
   – 2x 12-bit DAC output channels, low-power sample and hold
   – 2x operational amplifiers with built-in PGA
   – 2x ultra-low-power comparators
• 20x communication interfaces
   – USB OTG 2.0 full-speed, LPM and BCD
   – 2x SAIs (serial audio interface)
   – 3x I2C FM+(1 Mbit/s), SMBus/PMBus
   – 5x USARTs (ISO 7816, LIN, IrDA, modem)
   – 1x LPUART (Stop 2 wake-up
   – 3x SPIs (and 1x Quad SPI)
   – CAN (2.0B Active) and SDMMC interface
   – SWPMI single wire protocol master I/F
   – IRTIM (Infrared interface)
• 14-channel DMA controller
• True random number generator
• CRC calculation unit, 96-bit unique ID
• Development support: serial wire debug (SWD), JTAG, Embedded Trace Macrocell™
• All packages are ECOPACK2® compliant


CATALOG
STM32L476RGT6 COUNTRY OF ORIGIN
STM32L476RGT6 PARAMETRIC INFO
STM32L476RGT6 PACKAGE INFO
STM32L476RGT6 MANUFACTURING INFO
STM32L476RGT6 PACKAGING INFO
STM32L476RGT6 ECAD MODELS


COUNTRY OF ORIGIN
China
Malaysia
Philippines
Taiwan (Province of China)


PARAMETRIC INFO
Tradename STM32
Data Bus Width (bit) 32
Family Name STM32L
Device Core ARM Cortex M4
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 80
Program Memory Type Flash
Program Memory Size 1MB
RAM Size 128KB
Trace Hardware ETM
Maximum Dhrystone MIPS (MIPS) 100
DMA Channels 14
CAN Type 2.0A/2.0B
Direct Memory Access Yes
Floating Point Unit Yes
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Input Capture Channels 15
Output Compare Channels 15
Internal/External Clock Type Internal/External
Touch Sensing Interface Yes
Power On Reset No
Memory Protection Unit Yes
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Maximum CPU Frequency (MHz) 80
Number of Programmable I/Os 51
Number of Timers 14
ADC Channels 16/16/16
ADC Resolution (bit) 12/12/12
DAC Channels 2
Core Architecture ARM
Number of ADCs Triple
DAC Resolution (bit) 12
Number of DACs Single
PWM 2
Watchdog 2
LCD Segments 128|224
Analog Comparators 2
Parallel Master Port No
Real Time Clock Yes
Special Features CAN Controller,LCD Controller
Timers Resolution (bit) 16/32
Interface Type CAN/I2C/SAI/SPI/UART/USART/USB
Programmability Yes
SPI 3
I2C 3
I2S 0
UART 3
USART 3
CAN 1
USB 1
Ethernet 0
Maximum Power Dissipation (mW) 444
Minimum Operating Supply Voltage (V) 1.71
Typical Operating Supply Voltage (V) 1.8|2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 1.8|2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
 
PACKAGE INFO
Supplier Package LQFP
Basic Package Type Lead-Frame SMT
Pin Count 64
Lead Shape Gull-wing
PCB 64
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 10
Package Width (mm) 10
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 12
Package Overall Width (mm) 12
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BCD
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
Number of Wave Cycles N/R
 
PACKAGING INFO
Packaging Tray
Quantity Of Packaging 10000
 
ECAD MODELS


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