Intel Advanced Packaging Technologies Enable the Next Era of AI Computing with Foveros and EMIB

As artificial intelligence continues to drive unprecedented demand for computing power, the semiconductor industry is moving beyond the traditional approach of relying on a single large chip. Advanced packaging technology has become a critical foundation for connecting multiple specialized chips and enabling them to operate together as a powerful, integrated system. This approach allows future computing platforms to process increasingly complex and massive workloads with greater speed and efficiency.

Intel has been developing advanced chip packaging technologies for many years across the United States and around the world. Today, its advanced packaging capabilities represent one of the most important technologies behind next-generation multi-chip semiconductor products.

## Advancing U.S. Semiconductor Packaging at Intel’s New Mexico Facility

At Intel’s Rio Rancho, New Mexico facility, advanced packaging innovation is pushing beyond traditional size limitations. The site is expanding packaging capabilities to support package sizes up to eight times larger than today’s industry standards, with plans to exceed twelve times current limits by 2028.

The semiconductor industry has entered the era of the “system of chips,” where multiple specialized chiplets are connected together to form a powerful package — similar to creating a “silicon mosaic” made up of different functional pieces working as one.

"Back in the 1980s, this facility was a leader in six-inch wafer manufacturing. More than four decades later, it has transformed into a U.S. leader in advanced packaging," said Katie Prouty, Fab 9 Advanced Packaging Factory Manager at Intel New Mexico.

To address the enormous computing requirements of artificial intelligence, Intel is continuing to overcome physical limitations through innovative packaging technologies. Intel Foundry combines Foveros 3D stacking technology with EMIB (Embedded Multi-die Interconnect Bridge) technology to create highly integrated and powerful chip architectures.

"Some customers initially approached us specifically for advanced packaging solutions," Prouty explained. "By successfully meeting their packaging requirements, we continue to strengthen their trust and confidence in Intel as a leading foundry partner."

Since opening in Rio Rancho, New Mexico, in 1980 with only 25 employees, Intel’s operation has grown into a major technology hub with approximately 2,700 employees and more than 500 suppliers, helping bring advanced U.S.-based packaging capabilities to the global market.

## What Is Intel Foundry’s Foveros Advanced Packaging Technology?

One of the key advanced packaging technologies being developed at Intel’s Fab 9 facility is Foveros, which enables smaller specialized chiplets to be vertically integrated into a single high-performance system.

Foveros allows Intel Foundry to connect multiple chiplets onto a silicon base layer, known as an interposer. This technology can be compared to building a customized platform where different functional components are assembled together to create a complete computing solution.

"Inside the factory, chip placement equipment represents the first step of the Intel Foveros advanced packaging process," explained Chris Seibert, Principal Engineer at Intel New Mexico Fab 9. "If we compare it to making a pizza, the silicon wafer acts as the base, while different chiplets serve as the toppings that are precisely placed onto the surface."

After chip placement, the wafer moves through additional processing equipment where the components are bonded together. A robotic handling system then transfers the wafer to another stage, where epoxy material is applied around and beneath the chips to ensure strong mechanical connections.

Finally, the completed wafer is separated into individual packages using precision cutting equipment with water-cooled blades to maintain accuracy.

"The advantage of this process is that it allows us to combine multiple chips from different designs or process technologies into a single package," Seibert said.

Through Foveros technology, individual chiplets can function together as one powerful computing system, delivering faster performance for demanding workloads. By allowing power-intensive functions to be placed on more efficient process nodes, Foveros can also improve energy efficiency, extend battery life in laptops, and enable smaller edge computing devices without sacrificing performance.

The technology also enables more functionality to be integrated into compact designs, bringing advanced computing capabilities closer to users — from industrial environments to personal devices.

## EMIB: Intel’s Embedded Multi-die Interconnect Bridge Technology

Another key element of Intel’s advanced packaging portfolio is EMIB, or Embedded Multi-die Interconnect Bridge technology. Instead of using a large silicon interposer, EMIB uses small silicon bridges embedded within the package substrate to connect individual chiplets.

This approach allows multiple specialized chips to communicate efficiently as a unified system while delivering the performance required for AI workloads, improving efficiency, and reducing manufacturing complexity.

While some semiconductor manufacturers rely on expensive full-size silicon interposers for chip-to-chip connections, Intel Foundry places small, high-speed silicon bridges only where they are needed. This targeted approach reduces cost and enables the creation of powerful AI processors built from multiple chiplets.

For example, in data center products where several chips are positioned next to each other, EMIB creates direct communication pathways inside the package substrate without requiring a large wafer-scale interposer.

## EMIB-T: Improving Power Delivery for Next-Generation AI Systems

Intel’s latest advancement, EMIB-T, further enhances the capabilities of bridge-based packaging by adding additional channels that deliver power directly through the bridge structure. This improves power efficiency and supports the advanced signal routing requirements of next-generation high-bandwidth memory (HBM) technologies.

The importance of advanced packaging goes beyond simply increasing speed. It provides greater design flexibility by allowing chips from different sources and technologies to be integrated together within some of the industry's largest package platforms.

This flexibility enables Intel Foundry to support the next generation of AI computing systems, providing the foundation for powerful, scalable, and energy-efficient AI engines that will drive future data centers and intelligent applications.