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• Wide Analog Input Voltage Range |
• Low “ON” Resistance
- VCC = 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . 70Ω(Typ)
- VCC = 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60Ω(Typ) |
• Fast Switching and Propagation Speeds |
• “Break-Before-Make” Switching. . . . . 6ns (Typ) at 4.5V |
• Available in Both Narrow and Wide-Body Plastic
Packages |
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
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• Wide Operating Temperature Range . . . -55oC to 125oC |
• Balanced Propagation Delay and Transition Times |
• Significant Power Reduction Compared to LSTTL
Logic ICs |
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V |
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
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CATALOG |
CD74HC4067M96 COUNTRY OF ORIGIN |
CD74HC4067M96 PARAMETRIC INFO |
CD74HC4067M96 PACKAGE INFO |
CD74HC4067M96 MANUFACTURING INFO |
CD74HC4067M96 PACKAGING INFO |
CD74HC4067M96 ECAD MODELS |
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COUNTRY OF ORIGIN |
China |
Malaysia |
Taiwan (Province of China) |
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PARAMETRIC INFO |
Type |
Analog Multiplexer |
Number of Channels per Chip |
1 |
Multiplexer Architecture |
16:1 |
Maximum On Resistance Range (Ohm) |
150 to 250 |
Configuration |
Single 16:1 |
Number of Inputs per Chip |
16 |
Function |
General |
Process Technology |
CMOS |
Number of Outputs per Chip |
1 |
Logic Family |
HC |
Chip Enable Signals |
Yes |
Maximum On Resistance (Ohm) |
180@4.5V |
Maximum Propagation Delay Bus to Bus (ns) |
13@6V|15@4.5V|75@2V |
Maximum Turn-On Time (ns) |
300@2V |
Maximum Turn-Off Time (ns) |
290@2V |
Input Signal Type |
Single |
Output Signal Type |
Single |
Propagation Delay Test Condition (pF) |
50 |
Maximum Low Level Output Current (mA) |
25 |
Maximum High Level Output Current (mA) |
25 |
Maximum Frequency (25°C) @ Vcc (MHz) |
89@4.5V |
Special Features |
Break-Before-Make |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
125 |
Power Supply Type |
Single |
Minimum Single Supply Voltage (V) |
2 |
Typical Single Supply Voltage (V) |
3|5 |
Maximum Single Supply Voltage (V) |
6 |
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PACKAGE INFO |
Supplier Package |
SOIC |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
24 |
Lead Shape |
Gull-wing |
PCB |
24 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
15.6(Max) |
Package Width (mm) |
7.6(Max) |
Package Height (mm) |
2.35(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
15.6(Max) |
Package Overall Width (mm) |
10.63(Max) |
Package Overall Height (mm) |
2.65(Max) |
Seated Plane Height (mm) |
2.65(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC |
Package Family Name |
SO |
Jedec |
MS-013AD |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn|Au |
Under Plating Material |
N/A|Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
96 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2000 |
Reel Diameter (in) |
13 |
Tape Pitch (mm) |
12 |
Tape Width (mm) |
24 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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