STM32F746IEK6 STMicroelectronics IC MCU 32BIT 512KB FLASH 176BGA

label:

2023/08/28 220

• Core: ARM® 32-bit Cortex®-M7 CPU with FPU, adaptive real-time accelerator (ART Accelerator™) and L1-cache: 4KB data cache and 4KB instruction cache, allowing 0-wait state execution from embedded Flash memory and external memories, frequency up to 216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions.

• Memories
• Up to 1MB of Flash memory
• 1024 bytes of OTP memory
• SRAM: 320KB (including 64KB of data TCM RAM for critical real time data) + 16KB of instruction TCM RAM (for critical real time routines) + 4KB of backup SRAM (available in the lowest power modes)
• Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories

• Dual mode Quad-SPI

• LCD parallel interface, 8080/6800 modes

• LCD-TFT controller up to XGA resolution with dedicated Chrom-ART Accelerator™ for enhanced graphic content creation (DMA2D)

• Clock, reset and supply management
• 1.7 V to 3.6 V application supply and I/Os
• POR, PDR, PVD and BOR
• Dedicated USB power
• 4-to-26 MHz crystal oscillator
• Internal 16 MHz factory-trimmed RC (1% accuracy)
• 32 kHz oscillator for RTC with calibration
• Internal 32 kHz RC with calibration

• Low-power
• Sleep, Stop and Standby modes
• VBAT supply for RTC, 32×32 bit backup registers + 4KB backup SRAM

• 3×12-bit, 2.4 MSPS ADC: up to 24 channels and 7.2 MSPS in triple interleaved mode

• 2×12-bit D/A converters

• Up to 18 timers: up to thirteen 16-bit (1x lowpower 16-bit timer available in Stop mode) and two 32-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input. All 15 timers running up to 216 MHz. 2x watchdogs, SysTick timer

• General-purpose DMA: 16-stream DMA controller with FIFOs and burst support

• Debug mode
• SWD & JTAG interfaces
• Cortex®-M7 Trace Macrocell™

• Up to 168 I/O ports with interrupt capability
• Up to 164 fast I/Os up to 108 MHz
• Up to 166 5 V-tolerant I/Os

• Up to 25 communication interfaces
• Up to 4× I2C interfaces (SMBus/PMBus)
• Up to 4 USARTs/4 UARTs (27 Mbit/s, ISO7816 interface, LIN, IrDA, modem control)
•Up to 6 SPIs (up to 50 Mbits/s), 3 with muxed simplex I2S for audio class accuracy via internal audio PLL or external clock
• 2 x SAIs (serial audio interface)
• 2 × CANs (2.0B active) and SDMMC interface
• SPDIFRX interface
• HDMI-CEC

• Advanced connectivity
• USB 2.0 full-speed device/host/OTG controller with on-chip PHY
• USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI
• 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII

• 8- to 14-bit parallel camera interface up to 54 Mbytes/s

• True random number generator

• CRC calculation unit

• RTC: subsecond accuracy, hardware calendar

• 96-bit unique ID

CATALOG

STM32F746IEK6 COUNTRY OF ORIGIN

STM32F746IEK6 PARAMETRIC INFO

STM32F746IEK6 PACKAGE INFO

STM32F746IEK6 MANUFACTURING INFO

STM32F746IEK6 PACKAGING INFO

STM32F746IEK6 ECAD MODELS

COUNTRY OF ORIGIN

Philippines

Taiwan (Province of China)

PARAMETRIC INFO

Tradename	STM32
Data Bus Width (bit)	32
Family Name	STM32F
Device Core	ARM Cortex M7
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	216
Program Memory Type	Flash
Program Memory Size	512KB
RAM Size	340KB
Hardware Acceleration	FPU
Trace Hardware	JTAG/SWD
Maximum Dhrystone MIPS (MIPS)	462
DMA Channels	16
CAN Type	2.0B
Instruction Cache Size	4KB
Data Cache Size	4KB
Direct Memory Access	Yes
Floating Point Unit	Yes
Bluetooth	No
Wi-Fi	No
Ethernet Interface Type	MII/RMII
Ethernet Speed	10Mbps/100Mbps
Multiply Accumulate	No
Input Capture Channels	4
Output Compare Channels	4
Internal/External Clock Type	Internal/External
Touch Sensing Interface	No
Power On Reset	Yes
Memory Protection Unit	Yes
Temperature Sensor	Yes
DDR	No
Memory Management Unit	No
Integrated Development Environment	No
Super Scalar	No
External Bus Interface	No
Maximum CPU Frequency (MHz)	216
Number of Programmable I/Os	140
Number of Timers	15
ADC Channels	24/24/24
ADC Resolution (bit)	12/12/12
DAC Channels	2
Core Architecture	ARM
Number of ADCs	Triple
DAC Resolution (bit)	12
Number of DACs	Single
PWM	2
Watchdog	2
Parallel Master Port	No
Real Time Clock	Yes
Special Features	CAN Controller
Interface Type	CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB
Programmability	Yes
SPI	6
I2C	4
I2S	3
UART	4
USART	4
CAN	2
USB	2
Ethernet	1
Maximum Power Dissipation (mW)	513
Minimum Operating Supply Voltage (V)	1.7
Typical Operating Supply Voltage (V)	1.8\|2.5\|3.3
Maximum Operating Supply Voltage (V)	3.6
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Temperature Flag	Opr
Supplier Temperature Grade	Industrial
Operating Supply Voltage (V)	1.8\|2.5\|3.3
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

PACKAGE INFO

Supplier Package	UFBGA
Basic Package Type	Ball Grid Array
Pin Count	201
Lead Shape	Ball
PCB	201
Tab	N/R
Pin Pitch (mm)	0.65
Package Length (mm)	10
Package Width (mm)	10
Package Height (mm)	0.45
Package Diameter (mm)	N/R
Seated Plane Height (mm)	0.53
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Ultra Fine Pitch Ball Grid Array
Package Family Name	BGA
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	SnAg
Under Plating Material	N/A
Terminal Base Material	Cu Alloy
Shelf Life Period	2 Years

PACKAGING INFO

Packaging

Tray

ECAD MODELS