STM32H743IIK6 STMicroelectronics HIGH-PERFORMANCE & DSP DP-FPU AR

label:
2023/10/9 201



CATALOG
STM32H743IIK6 COUNTRY OF ORIGIN
STM32H743IIK6 PARAMETRIC INFO
STM32H743IIK6 PACKAGE INFO
STM32H743IIK6 MANUFACTURING INFO
STM32H743IIK6 PACKAGING INFO
STM32H743IIK6 ECAD MODELS


COUNTRY OF ORIGIN
China
France
Germany
Philippines
Taiwan (Province of China)
United States of America


PARAMETRIC INFO
Tradename STM32
Data Bus Width (bit) 32
Family Name STM32H
Device Core ARM Cortex M7
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 480
Program Memory Type Flash
Program Memory Size 2MB
RAM Size 1060KB
Maximum Expanded Memory Size 4GB
Hardware Acceleration FPU
Trace Hardware JTAG/SWD
Maximum Dhrystone MIPS (MIPS) 2.14
DMA Channels 4
Instruction Cache Size 16KB
Data Cache Size 16KB
Direct Memory Access Yes
Floating Point Unit Yes
Bluetooth No
Wi-Fi No
Ethernet Interface Type MII/RMII
Multiply Accumulate No
Input Capture Channels 4
Output Compare Channels 4
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset Yes
Memory Protection Unit Yes
Temperature Sensor Yes
DDR Yes
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Maximum CPU Frequency (MHz) 480
Number of Programmable I/Os 140
Number of Timers 18
ADC Channels 32/32/32
ADC Resolution (bit) 16/16/16
DAC Channels 2
LIN 1
Number of Cores 1
Core Architecture ARM
Number of ADCs Triple
DAC Resolution (bit) 12
Number of DACs Single
PWM 4
Watchdog 2
Analog Comparators 2
Parallel Master Port No
Real Time Clock Yes
Special Features CAN Controller
Interface Type CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB
Programmability Yes
SPI 6
I2C 4
Process Technology 40nm
I2S 3
UART 5
USART 4
CAN 2
USB 2
Ethernet 1
Maximum Power Dissipation (mW) 1070
Minimum Operating Supply Voltage (V) 1.62
Typical Operating Supply Voltage (V) 1.8|2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 1.8|2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package UFBGA
Basic Package Type Ball Grid Array
Pin Count 201
Lead Shape Ball
PCB 201
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 10
Package Width (mm) 10
Package Height (mm) 0.45
Package Diameter (mm) N/R
Package Overall Length (mm) 10
Package Overall Width (mm) 10
Package Overall Height (mm) 0.6(Max)
Seated Plane Height (mm) 0.6(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Ultra Fine Pitch Ball Grid Array
Package Family Name BGA
Jedec N/A


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnAg
Under Plating Material N/A
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tray
Packaging Document Link to Datasheet


ECAD MODELS


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